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材料と環境 Vol. 72 (2023), No. 10

ISIJ International
belloff
オンライン版ISSN: 1881-9664
冊子版ISSN: 0917-0480
発行機関: Japan Society of Corrosion Engineering

Backnumber

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キーワードランキング

13 Dec. (Last 30 Days)

材料と環境 Vol. 72 (2023), No. 10

リンを含む銅管の応力腐食割れ発生過程における皮膜の析出挙動

中島 孝仁, 谷村 浩, 深見 一弘, 邑瀬 邦明

pp. 259-268

DOI:

10.3323/jcorr.72.259

抄録

The deposition behavior of films, corrosion products, during SCC on a phosphorus copper tube in an ammonia solution was investigated. It was found that Cu(OH)2 deposited on the tube surface and Cu2O deposited in the intergranular corrosion pit. The electrochemical behavior of the copper tube during SCC test indicated that pH in the intergranular corrosion pit is lower than that near the surface due to dissolution of phosphorus. Considering these environments, the difference of the deposited film type was explained by thermodynamics. It was also presumed that the Cu2O deposited thickly at the tip of the corrosion pit became the source of stress, leading to the occurrence of cracking.

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